• Operator control process
• Automatic and programmable Process control with scheduling, storage and retrieval capabilities
• Magnetron Sputtering based on voltage control
• Magnetron Sputtering based on current control
• Magnetron Sputtering based on power control (As requested)
• Magnetron Sputtering based on Low Power Real Pulsed Sub Layer  Bias control
• Magnetron Sputtering based on     Z    control (As requested)
• Smooth, flat and accurate layer of edge to substrate center without Dependence on cathode geometry and substrate for application SEM)
• Intelligent Subsystem Thickness Measurement
• Intelligent subsystem pressure measurement
• Intelligent subsystem Control and adjust the sub-layer rotational speed(As requested)
• Intelligent subsystem controls the layout in two modes PID and FORCASTING
• Intelligent subsystem for controlling switches, valves, sputtering and vacuum pumps
• cathode with the ability to adjust the radius
• Fixed cathode
• Round stage, height-adjustable and tillable (Ø76mm) to hold your samples (As requested)
• Round stage with rotating capability (As requested)
• Film-thickness measurement quartz measuring system (for small samples at the center, for large samples at the edge)
• USB interface for easy process analysis and software update
• Diagnosis and process optimization.
• Application can easily upgrade
• The pressure, thickness, current and voltage for the process are displayed along with the film thickness and coating rate.
• Stack Round stage holder
• The processes executed by the unit are stored and depicted in the history function
• Modular design of software and hardware
• Basic application software and the possibility of modification according to customer request
• Control the coating process by using the Visual Studio platform
• Control the coating process by HMI (As requested)
• Control the process of the coating by computer and HMI (As requested)
• Small size and low weight

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